芯片排阻
Bourns 提供多种标准阻值和常用尺寸的芯片排阻。这些芯片排阻提供设计者在效能、空间的节省,以及低成 本各种现有的弹性。除了标准隔离及总线设定之外,数种高速终端芯片排阻用于 FPGAs,无论是 LVDS 或 LVPCL I/O 标准均可 使用。
典型的应用包含:玩具、行动电话,以及消费性产品。
Series | |||||
产品图片 | |||||
电阻范围 | 10 ohms to 1 megohm | 10 ohms to 1 megohm | 10 ohms to 1 megohm | 10 ohms to 1 megohm | 10 ohms to 1 megohm |
允许公差 | ±5 % | ±1 % | ±5 % | ±5 % | ±5 % |
温度系数 | ±250 ppm/°C | ±200 ppm/°C | ±200 ppm/°C | ±200 ppm/°C | ±250 ppm/°C |
单颗电阻功率 | 0.031 W | 0.062 W | 0.062 W | 0.062 W | 0.031 W (-J2); 0.063 W (-J4) |
外观 / 包装类型 | array | array | array | array | array |
实体构型 | chip product | chip product | chip product | chip product | chip product |
RoHS 规范 |
Series | |||||
产品图片 | |||||
电阻范围 | 10 ohms to 1 megohm | 10 ohms to 1 megohm | CAY17-JA: 10 ohms to 100K ohms; CAY17-JB: 10 ohms to 43K ohms | R1 = 165 ohms; R2 = 140 ohms | R1 = 165 ohms; R2 = 140 ohms |
允许公差 | ±1 % | ±5 % | ±5 % | ±1% | ±1 % |
温度系数 | ±200 ppm | ±200 ppm/°C | ±250 ppm/°C | ±200 ppm/°C | ±200 ppm/°C |
单颗电阻功率 | 0.062 W | 0.062 W | 0.031 W | 0.00625 W | 0.00625 W |
外观 / 包装类型 | array | array | array | array | array |
实体构型 | chip product | chip product | chip product | chip product | chip product |
RoHS 规范 |
Series | |||||
产品图片 | |||||
电阻范围 | R1 = 100 ohms; R2 = 187 ohms | R1 = 100 ohms; R2 = 187 ohms | R1 = 70 ohms; R2 = 187 ohms | R1 = 100 ohms | R1 = 100 ohms |
允许公差 | ±1 % | ±1 % | ±1 % | ±1 % | ±1 % |
温度系数 | ±200 ppm/°C | ±200 ppm/°C | ±200 ppm/°C | ±200 ppm/°C | ±200 ppm/°C |
单颗电阻功率 | 0.00625 W | 0.00625 W | 0.00625 W | 0.00625 W | 0.00625 W |
外观 / 包装类型 | array | array | array | array | array |
实体构型 | chip product | chip product | chip product | chip product | chip product |
RoHS 规范 |